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A community for news and discussion about the hardware side of technology. Questions and support posts are also welcome, so long as they are relevant to hardware and interesting technologies therein.


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submitted 6 months ago* (last edited 6 months ago) by ulterno@programming.dev to c/hardware@programming.dev
 
 

What is the rationale behind GPU heatsink fin design?

So I have seen a few GPU heatsinks and I wonder why some of them are how they are.

GPU placement in Cabinet

The originally intended and most widely used placement for ATX cases at least, is installing right on the PCIe slot, which goes horizontally and with the air incoming from the front of the case.

gpu_traditional_fit

Then we have the "vertical" placement using the riser cable, which changes the direction from which the GPU fans take in air, but keep the GPU front, in the same direction, again lining up with the incoming air from the front.

gpu_trendy_fit

Finally the very rare vertical placement, which has the front of the GPU rotated towards the top of the case, making it not line up with an airflow incoming from the front.
This also makes the GPU's ports inaccessible the standard way, giving a reason to the rarity.

gpu_exotic_fit

Some examples I found for this

Here we see that the first 2 placements would make up most of the ATX PC builds with the third one being either for different case styles or for extensively customised builds.

Fins, fans and airflow

I would assume that having the air flow along the fins would be better than it crossing the fins at ⦜90°. And even if the air flow due to the case inlet is being ⟂ to the airflow from the GPU fans (in case of front incoming air flowing along the fins), it should still lead to overall increase in air pressure (hence, air density) between the fins.^[Source: Mental simulation] Considering that GPUs tend to have gaps in the IO shield to let the air go out the back, I would assume they (designers of the thermal dissipation solution) want air from the fins to go out the back, which would be better with fins parallel to front incoming air.

gpu_airflow_illust

Inference and Doubt

From the above 2, it would make sense for most GPUs to have their heatsink fins going along their length instead of their width, right?

Then what's up with the ASRock lineup, with all cards other than the Passive model, the Creator cards (which have the front covered by the shroud anyway, so no incoming airflow) and the watercooled cards (which is not applicable) having the fins ⟂ to front air inlet?
And of course they are not the only one doing it that way.


Follow Up

While discussing in this thread, I realised another point (which I didn't state anywhere in the comments):

  • While it is desirable to have higher air density, it is not desirable to have air increasing in density while in the inter-fin space. Because that would cause the heat released when changing density to be transferred to the fins.
  • Another way to say that is, the air will get hotter, while increasing its density. So, how much this factor matters, will depend upon the initial temperature difference between the air and the fins and how long the dense air stays in the inter-fin space. Oh and also the composition of air.
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I recently found myself needing to change the monitor that a cheap HDMI “dummy plug” pretended to be. It was a random one I had bought on Amazon several years ago that acted as a 4K monitor, and I needed it to be something simpler that didn’t support a 4K resolution. The story behind why is a long one that I’m still figuring out and might eventually become a separate blog post in the future.

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Chinese companies Huawei and SMIC may have a difficult time accessing resources needed to build AI chips, due to Taiwanese export controls.

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In a bold challenge to silicon s long-held dominance in electronics, Penn State researchers have built the world s first working CMOS computer entirely from atom-thin 2D materials. Using molybdenum disulfide and tungsten diselenide, they fabricated over 2,000 transistors capable of executing logic operations on a computer free of traditional silicon. While still in early stages, this breakthrough hints at an exciting future of slimmer, faster, and dramatically more energy-efficient electronics powered by materials just one atom thick.

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